Editor's Note
This editor’s note highlights the key facts and market implications behind “2023 TPCA Tongtai x Tongjie AI Server Board High”, with emphasis on sourcing, product fit, fabrication, logistics, or buyer impact.
Tongtai Precision Machinery and Tongjie Technology jointly exhibit at the 2023 TPCA exhibition, attracting attention with their 'AI Server Board High-Precision and Efficient Solutions'.
Tongtai Precision Machinery (4526.TW) and Tongjie Technology (8064.TW) will participate in the 2023 Taiwan Printed Circuit Board Industry International Exhibition (2023 TPCA) from October 25 to 27, at booth N-1321. The exhibition theme for the 'Two Tongs' is 'AI Server Board High-Precision and Efficient Solutions', leveraging concepts of 'intelligent automation, precision, and low carbon' to target opportunities in AI server boards and substrates with various high-end models.
Tongtai Precision Machinery will showcase three machines: the CNC PCB drilling machine TDL-620CL, the CNC PCB drilling machine TDL-130CL-M, and the multi-axis compensation CNC PCB drilling machine TCDM-220CL. The TDL-620CL features a large table design with a processing range of 660 x 813 mm, catering to the demand for large-area substrates in AI servers and high-speed computing. Its X/Y axes use a new high-rigidity steel structure, and a thermal affinity design reduces the thermal impact of prolonged processing on high-end server boards. It also offers an optional automatic spindle chuck cleaning function to address operator inconvenience. Unlike traditional cast iron beds, the TDL-130CL-M uses a bed made of artificial mineral casting material, offering excellent vibration resistance, wear resistance, insulation, low thermal conductivity, and a low thermal expansion coefficient for more stable processing.
Cold casting produces low carbon emissions, and waste materials can be recycled and crushed for reuse, perfectly realizing ESG principles. The X/Y axes use high-precision optical scales and linear motors for high processing accuracy, suitable for high-precision substrates, server boards, and semiconductor packaging drilling. The TCDM-220CL features independent X/Y/Z axis control, with each axis equipped with CCD visual compensation and CBD depth compensation functions to correct board warpage and expansion. Back-drilling depth accuracy reaches ±0.02mm, and it is paired with an automated feeding system to effectively improve machine utilization and address labor shortages. Tongtai Precision Machinery has long been deeply involved in R&D of high-end mechanical drilling and laser processing systems, with mature capabilities in semiconductor packaging processing and IC substrate processing technologies, earning recognition from renowned domestic semiconductor and IC substrate manufacturers.
Tongjie Technology focuses on the 'Fan-Out Package Glass Substrate Cutting and Repair Complete Solution', covering equipment including RDL laser line repair, glass substrate cutting, glass substrate drilling for packaging, glass substrate edge EMC trimming, laser lift-off equipment, and plasma etching. This fully demonstrates its core technological advantages in lasers, optical inspection, and automated electromechanical integration.
The Re-Distribution Layer laser line repair equipment features metal line defect repair capabilities, controlling repair line width to 1μm to meet product repairs with 2μm line width and spacing. It is equipped with automatic optical measurement and flexible adjustment of low to high magnification lenses, enabling fast, automated, and precise measurement. It can automatically plan repair paths, effectively saving costs and improving efficiency.
The glass cutting machine features a dual-laser, dual-axis architecture for modification and thermal cracking, enabling rapid automated cutting of composite structures and freeform transparent brittle materials, with cutting chipping controlled within 10μm to meet high-yield, high-quality process requirements. The glass substrate drilling equipment uses laser modification and wet processes to achieve Through Glass Via (TGV) technology with an aspect ratio greater than 5:1.
The glass substrate edge epoxy molding compound trimming equipment uses laser synchronous double-sided processing technology to precisely remove edge flash, allowing the glass substrate to be reused after the lift-off process, aligning with green production concepts. The laser lift-off combined with plasma etching equipment uses an integrated microwave and RF plasma design for stronger residue removal, achieving a dual-process automated integration architecture.
Tongjie Technology is also deeply involved in Micro-LED. Its Laser Induced Transfer Bonding (LIBT) technology can be applied to two mainstream backplane technologies: COB (Chip on Board) and COG (Chip on Glass). This Micro LED mass transfer equipment can simultaneously complete mass release and bonding of Micro LEDs, paired with a Smart & Selective Mass Repair (SSMR) system to improve final product yield to 99.999%.
The joint exhibition by Tongtai Precision Machinery (4526.TW) and Tongjie Technology (8064.TW) fully demonstrates their achievements in equipment development for AI server boards, substrate drilling, and redistribution layer repair across various process stages, promising significant exhibition benefits.
Source: Read the original article | Published: October 25, 2023